High-Performance Chiplet Die-to-Die Interconnect IP
Chiplet-based method has become a trending technology in the field of high-performance chip design. JinLei 3200 high-performance chiplet interconnection IP is designed with a special fusion architecture, which can support a variety of interface protocols, multiple package types, and a variety of mainstream process nodes. With excellent performance and efficiency, support for safe and reliable transmission, especially ultra-low latency, it is a specialized interconnect IP solution tailored for chiplet integration.