Zhi Xing
Zhi Xing

High Performance Chiplet Die-to-Die Interconnect Total Solution

CLCI is a M2Semi’s solution for Die-to-Die interconnect IP.

 “Zhi Xing” is the latest D2D interconnect architecture of 2nd CLCI. It also includes MAC+PHY layer and the reference design of interconnect-package.

 It provides the built-in self-test (BIST) and external PHY-to-PHY link tests for on-chip testability and visibility into channel performance.

 It supports a variety of interface protocols and a variety of mainstream process nodes.

 It’s ready for MP. The silicon-proven EVB board can be provided to customer for evaluation.


Application：



Cloud Computing



Artificial Intelligence



Communication


Autonomous Driving


  Key Features：



Key Features：

Its key feature can be summarized into three points: high performance, high reliability, and easy to use.

 

High Performance

- Already support 6/7/12/16nm

- Data rate up to 32Gbps per laneZhi Xing-更新

- Support 4/8/16/32 configurable data lanes

- Typical efficiency less than 1.0pJ/b

- Ultra low D2D latency, especially for xPU application

- Support max D2D connection distance 30mm

 

High Reliability

    - Silicon Proven, can provide evaluation kit and silicon report

     - BER<10-15 without ECC

     - Built-in self-test (BIST) & data retransmission mechanism

- Pass 1000h aging tests

- Pass various environment & reliability tests

- Already mass production in several projects

 

Easy to use

- Support AXI/ACE/CHI/CXS.B multiple system bus

- Support 2D/2.5D multiple packaging stack-up

- Proven silicon, evaluation platform, integration tools

- Support customized D2D connect feature

- Support D2D/C2C dual mode

- Support direct connection to the FPGA


Previous:无Next:无

Related